HIGH PERFORMANCE 3D FET STRUCTURES, AND METHODS FOR FORMING THE SAME USING PREFERENTIAL CRYSTALLOGRAPHIC ETCHING

摘要

The present invention relates to high performance three-dimensional (3D) field effect transistors (FETs). Specifically, a 3D semiconductor structure having a bottom surface (20A) oriented along one of a first set of equivalent crystal planes { 100} and multip additional surfaces (20B) oriented along a second, different set of equivalent crystal planes can be used to form a high performance 3 FET with carrier channels oriented along the second, different set of equivalent crystal planes. More importantly, such a 3D semiconductor structure can be readily formed over the same substrate (12) with an additional 3D semiconductor structure having a bottom surface and multiple additional surfaces all oriented along the first set of equivalent crystal planes. The additional 3D semiconductor structure can be used to form an additional 3D FET, which is complementary to the above-described 3D FET and has carrier channels oriented along the first set of equivalent crystal planes.