ULTRA WIDE BAND HERMETIC SURFACE MOUNT TECHNOLOGY MICROWAVE MONOLITHIC INTEGRATED CIRCUIT PACKAGE

摘要

The discontinuity of the perpendicularity transition can be minimized by obtaining a small insertion loss and good junction using a trough line and slab line. The ultra-wide band hermetic sealing surface mount package for the integrated circuit comprises an integrated circuit(20); a plurality of first dielectrics(26) of multilayer, and the first line part which is mounted on the circuit board(21) and is electrically connected with the external circuit(15); a second line part(13,14) electrically connected with the first line part; the third line part which is electrically connected to the second railroad track part and is extended from the second railroad track part to the right; the bonding unit(19) which electrically connects the third railroad track part and the mounted integrated circuit; a plurality of second dielectrics which is formed in upper part of the package body and seals the integrated circuit hermetically, and is formed with multilayer; a package cover(11).