GAS SUPPLYING APPARATUS, APPARATUS FOR DEPOSITING THIN FILM ON WAFER HAVING THE SAME AND METHOD FOR DEPOSITING THIN FILM ON WAFER USING THE SAME

摘要

A thin film depositing apparatus employing a fuel gas supplying apparatus is provided to deposit a thin film with uniform thickness and improve deposition rate by supplying plural gases through one gas supplying apparatus. A thin film depositing apparatus employing a fuel gas supplying apparatus comprises the following units. A lead plate(210) includes a supply opening for supplying fuel gas. A spreading plate(220) is placed at a predetermined distance from the lead plate. A spraying plate(230) is positioned at a determined distance below the spreading plate. A plurality of through-holes(221) are combined with a first spreading space of the spreading plate.