ELECTRICAL COMPONENTS WITH IMPROVEMENT OF MECHANICAL PROPERTY, BONDED STRUCTURAL BODY THEREBETWEEN, AND BONDING METHOD THEREOF

摘要

Electrical components, a bonded structural body therebetween, and a bonding method thereof are provided to prevent the mechanical vulnerability of the solder joint by arranging the unleaded solder on a metal layer. The electronic component comprises metal layers(2,3). The metal layers are successively integrated on a substrate(5). One among the metal layers comprises the copper. The other metal layer is arranged on one metal layer. The other metal layer comprises the zinc. The coupling structure comprises junction between the solder and the metal layer. The metal layer comprises the zinc. Solder does not include the lead(Pb).