Electrical components with improvement of mechanical property, Bonded structural body therebetween, and Bonding method thereof

摘要

The invention of claim 1, the lower metal layer made of a first metal formed on a substrate , the substrate, the It formed on the first inner metal layer and a copper- metal layers consisting of the second lower to step zinc alloy , and the second inner metal layer and the electronic component having a solder to form a joint structure , and provides a joint between the structure and its method of joining electronic components .