首页> 外国专利> MOISTURE-REACTIVE ADHESIVE COMPOSITIONS WITH VERY LOW TEMPERATURE DEPENDENCY OF THE SHEAR MODULUS

MOISTURE-REACTIVE ADHESIVE COMPOSITIONS WITH VERY LOW TEMPERATURE DEPENDENCY OF THE SHEAR MODULUS

机译:剪切模量非常低的湿敏胶组合物

摘要

A moisture-reactive adhesive composition is provided to cure without bubbles, to realize excellent mechanical characteristic value, and to show excellent adhesion effect to glass, ceramics, metal and paint. A moisture-reactive adhesive composition comprises (a) one or more dialdimines expressed as the following chemical formula (I); and (b) one or more polyurethane polymer P1 which is liquid at room temperature and contains an isocyanate group. The adhesive compound after being kept at room temperature and under 50% relative humidity for 7 days has the relative ratio of the shear modulus measured at 23°C to the shear modulus measured at -20 °C to be less than 1.7, especially, 1.5, preferably 1.4. In the chemical formula (I), A is C2-15 divalent aliphatic, cycloaliphatic or arylaliphatic hydrocarbon radical; and Y is an aldehyde radical according to the removal of O=CH.
机译:提供了一种湿气反应性粘合剂组合物,其固化无气泡,实现优异的机械特性值,并显示出对玻璃,陶瓷,金属和油漆的优异粘合效果。湿气反应性粘合剂组合物包含(a)一种或多种以以下化学式(I)表示的二亚胺; (b)一种或多种在室温下为液态且含有异氰酸酯基的聚氨酯聚合物P1。在室温和50%相对湿度下放置7天后的胶粘剂化合物,其在23°C下测得的剪切模量与在-20°C下测得的剪切模量的相对比小于1.7,尤其是小于1.5 ,最好是1.4。在化学式(I)中,A为C 2-15二价脂族,脂环族或芳基脂族烃基; Y是根据O = CH的去除而形成的醛基。

著录项

  • 公开/公告号KR20090027176A

    专利类型

  • 公开/公告日2009-03-16

    原文格式PDF

  • 申请/专利权人 SIKA TECHNOLOGY AG;

    申请/专利号KR20080089679

  • 发明设计人 KONSTANZER MARTIN;BURCKHARDT URS;

    申请日2008-09-11

  • 分类号C09J161/00;C09J175/04;

  • 国家 KR

  • 入库时间 2022-08-21 19:13:49

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