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PROGNOSTIC SYSTEM OF PROCESS PARAMETER PREDICTING SHAPE OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR FABICATION EQUIPMENT HAVING THE PROGNOSTIC SYSTEM OF PROCESS PARAMETER AND METHOD OF USING THE SEMICONDUCTOR FABICATION EQUIPMENT HAVING THE SAME
PROGNOSTIC SYSTEM OF PROCESS PARAMETER PREDICTING SHAPE OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR FABICATION EQUIPMENT HAVING THE PROGNOSTIC SYSTEM OF PROCESS PARAMETER AND METHOD OF USING THE SEMICONDUCTOR FABICATION EQUIPMENT HAVING THE SAME
An estimation system of a process parameter of a semiconductor structure, a semiconductor manufacturing apparatus having the estimation system of a process parameter, and a method for using the same are provided to estimate a size of a shape of a semiconductor structure by using an estimation parameter generated after or while manufacturing the semiconductor. Semiconductor structures are reacted with the process gas and the plasma is sequentially produced in a processing chamber. Sensor parameters from the plasma are obtained by using a sensor. Observation parameters from the semiconductor structures detached from the process chamber are obtained by using a measuring unit(15). The selected observation parameters corresponding to the selected semiconductor structures and the process estimation model equation and a boundary condition based on the linearity of the selected sensor parameters are selected(20). One sensor parameter which is firstly manufactured among the remaining semiconductor structures is compared with the boundary condition by using the process estimation unit(25). The semiconductor structures are classified by the process sequence of the semiconductor manufacturing process. The selected semiconductor structures are previously manufactured in comparison with the remaining semiconductor structures.
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