首页> 外国专利> CONTACT FORCE SENSOR PACKAGE, BLOOD PRESSURE MEASURING DEVICE WITH THE SAME, AND METHOD FOR FABRICATING THE CONTACT FORCE SENSOR PACKAGE

CONTACT FORCE SENSOR PACKAGE, BLOOD PRESSURE MEASURING DEVICE WITH THE SAME, AND METHOD FOR FABRICATING THE CONTACT FORCE SENSOR PACKAGE

机译:接触力传感器包,具有该接触力传感器的血压测量装置以及用于制造接触力传感器包的方法

摘要

A contact force sensor package, a blood pressure measuring unit including the same, and a method for manufacturing the contact force sensor package are provided to improve sensitivity by reducing a radial artery and a thin film when sensing a pulse. A vibration sensor and a first bonding pad(107) are arranged in an upper part of a substrate layer(102). A flexible printed circuit board layer(110) includes a second bonding pad(112). A second bonding pad is arranged in a place corresponding to the first bonding pad. The second bonding pad is electrically connected to the first bonding pad. One side of a vibration transmitting unit is in contact with the one side of the vibration sensor. The other side of the vibration transmitting unit is in contact with the human body. The vibration transmitting unit transmits the pulse to the vibration sensor. A junction layer(130A) is formed between the substrate layer and the flexible printed circuit board layer. The junction layer is not formed in a region overlapped with the vibration transmitting unit.
机译:提供了接触力传感器封装,包括其的血压测量单元以及制造该接触力传感器封装的方法,以通过在感测脉搏时减少a动脉和薄膜来提高灵敏度。振动传感器和第一焊盘(107)布置在基板层(102)的上部中。柔性印刷电路板层(110)包括第二焊盘(112)。在与第一焊盘相对应的位置上布置第二焊盘。第二结合垫电连接至第一结合垫。振动传递单元的一侧与振动传感器的一侧接触。振动传递单元的另一侧与人体接触。振动发送单元将脉冲发送到振动传感器。在衬底层和柔性印刷电路板层之间形成结层(130A)。在与振动传递单元重叠的区域中未形成接合层。

著录项

  • 公开/公告号KR20090075537A

    专利类型

  • 公开/公告日2009-07-08

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20080001429

  • 发明设计人 KIM JONG PAL;

    申请日2008-01-04

  • 分类号A61B5/02;

  • 国家 KR

  • 入库时间 2022-08-21 19:13:01

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