METHOD FOR MAINTAINING AND REPAIRING A SEMICONDUCTOR PROCESS MASK, INCREASING AN ADHESIVE STRENGTH OF A PELLICLE STRUCTURE ABOUT A RETICLE

摘要

PURPOSE: A method for maintaining and repairing a semiconductor process mask is provided to detach a pellicle structure from a reticle without increasing a cleaning solution and a cleaning time.;CONSTITUTION: A first structure and a second structure bonded with a thermal curable material are provided. The adhesive including the thermal curable material is provided between the first structure and the second structure. The first and second structures are bonded using the adhesive. The first structure and the second structure are detached. An ashing process is performed for the first structure. The first structure is a reticle(110). The second structure is a pellicle structure(150).;COPYRIGHT KIPO 2010