MANUFACTURING METHOD OF A BOARD-ON-CHIP PACKAGE SUBSTRATE CAPABLE OF EFFICIENTLY REDUCING GENERATION OF A BURR IN WINDOW PROCESSING

摘要

PURPOSE: A manufacturing method of a board-on-chip package substrate is provided to efficiently reduce generation of a burr by forming a window after a photoresist ink is locally printed on a processing part.;CONSTITUTION: A wire bonding pad, a solder ball pad, and a plating lead line are formed on one surface of an insulation substrate(S10). A solder resist in which an opening part corresponding to the wire bonding pad, the solder ball pad, and the plating lead line is formed is formed on one surface of the insulation substrate(S20). A surface processing layer is formed on a surface of the wire bonding pad and the solder ball pad(S30). A photoresist ink is selectively coated on a surface of the plating lead line through an inkjet mode(S40). A window penetrating the insulation substrate is formed by processing the region in which the photoresist ink is coated(S50).;COPYRIGHT KIPO 2010