ACTIVE DEVICE EMBEDDED PRINTED CIRCUIT BOARD WITH SELF FAILURE TEST CAPABILITY

摘要

An active device embedded printed circuit board with a self failure test capability is provided to sense a defect of a semiconductor without additional equipment by using conventional open or short circuit inspection equipment. A semiconductor chip(200) comprises an input / output pad and a pair of the output pad. A pair of output pad is positioned the edge of the chip pad layout. A connection wiring between a pair of output pad is arranged along a blind angle of the semiconductor chip. Therefore, the connection wiring surrounds a core circuit of the semiconductor chip. A pair of copper foil pads(110,120) is electrically connected with a pair of output pad. The defect of the semiconductor chip is determined by the electrical open or short between a pair of copper foil pad.