The present invention manufactured by the method for producing a conditioner for CMP pad and a method which can achieve relates to a conditioner for CMP pads required for the wide-area flattening operation of the wafer, excellent dressing efficiency and performance reproducibility for the high integration of semiconductor devices CMP to keondisyeoneoeul to provide for the pad, and with the purpose. ; The present invention relates to securing a plurality of abrasive grains by electrodeposition method in the metal-based plate according to the method for producing a conditioner for CMP pads, particles polished using a painless former frame with a plurality of through-holes is greater than the diameter of the abrasive particles is formed the location was then energized by removing the, painless frame before attaching the abrasive particles after the first plated metal-based plate for 0.3~4 hours, and then plated over upbringing 0.5 to 6 time method of manufacturing CMP pad conditioners and two and the CMP pad conditioners made by the method in the invention. ; According to the present invention, it is possible to provide a pad conditioner for CMP that can achieve excellent dressing efficiency and performance reproducibility. ; CMP, conditioner, abrasive particles, abrasive particles County, painless former framework
展开▼
