PACKAGING METHOD OF LIGHT EMITTING DIODE THAT HAS A HIGH-EFFICIENCY LATERAL LIGHT-EMITTING EFFECT AND STRUCTURE THEREOF

摘要

package structure of the light emitting diode chip having a horizontal high-efficiency light-emitting effect with respect to the present invention , the substrate and the light-emitting unit comprises a package unit and the resin unit . Among the substrate unit has a respective conductive traces formed anode and a cathode conductive traces on the substrate body and the substrate body . In this light emitting unit has a plurality of light-emitting diode chip is installed on the substrate main body , each of the light-emitting amount of the substrate unit , the negative electrode dayiohdeueun has a positive terminal electrically connected to the conductive trace and a negative extreme , each package unit having a plurality of resin that covers each resin package over the light emitting diode chip , wherein the top and front of the arc and each package resin resin wax can exit each has a face .