Pb free solder composition for wave and deeping, electronic equipment and PCB with the same

摘要

A Pb-free solder composition which prevents oxidation of molten solder consistently and effectively, maintains conventional Pb-free soldering temperature and wettability, and can improve soldering adhesive property by containing Si and Co in a ternary Sn-Cu-P solder composition, and an electronic equipment and a PCB using the same are provided. A Pb-free solder composition comprises 0.1 to 5 wt.% of copper, 0.001 to 0.2 wt.% of phosphorous, 0.001 to less than 0.05 wt.% of silicon, and the balance of tin. The Pb-free solder composition further comprises 0.001 to less than 0.01 wt.% of cobalt. As an electronic equipment comprising a plurality of electronic components adhered by a Pb-free solder alloy, the electronic equipment is characterized in that the Pb-free solder alloy comprises 0.1 to 5 wt.% of copper, 0.001 to 0.2 wt.% of phosphorous, 0.001 to less than 0.05 wt.% of silicon, and the balance of tin. As a PCB(printed circuit board) adhered by a Pb-free solder alloy, the PCB is characterized in that the Pb-free solder alloy comprises 0.1 to 5 wt.% of copper, 0.001 to 0.2 wt.% of phosphorous, 0.001 to less than 0.05 wt.% of silicon, and the balance of tin.