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METHOD OF PLATING COPPER ON MAGNESIUM ALLOY AND COPPER PLATING MAGNESIUM ALLOY

机译:镁合金镀铜的方法及镁合金镀铜

摘要

A method of plating copper on a magnesium alloy and a copper-plated magnesium alloy are provided to form an electro-copper layer on a magnesium alloy surface without an electroless copper plating process by using pyrophosphate copper plating solution including the compound of alkali metal and fluorine or ammonia and fluorine. A method of plating copper on a magnesium alloy and a copper-plated magnesium alloy comprises following steps. A magnesium alloy surface is fat-removed and is pickled. The pyrophosphate solution consisting of potassium pyrophosphate 200 g/l~350 g/l and cupric pyrophosphate 50 g/l~120 g/l is formed. The compound 20 g/l~90 g/l of the fluorine and alkali metal is added to the pyrophosphate solution and the electrolyte composition is formed and the magnesium alloy surface is dipped. The copper is plated on the magnesium alloy by applying current of 5~200mA/cm^2 in the electrolyte composition and controlling pH into 8.5~10.5. The temperature of composition is 45~65°C. The compound of the fluorine and alkali metal is the lithium fluoride the sodium fluoride or the potassium fluoride.
机译:提供了一种通过使用包括碱金属和氟的化合物的焦磷酸盐镀液,在镁合金上镀铜的方法和镀铜的镁合金,以在镁合金表面上形成电铜层,而无需化学镀铜工艺。或氨和氟。在镁合金和镀铜的镁合金上镀铜的方法包括以下步骤。镁合金表面已脱脂并酸洗。形成由200 g / l〜350 g / l的焦磷酸钾和50 g / l〜120 g / l的焦磷酸铜组成的焦磷酸盐溶液。将氟和碱金属的化合物20 g / l〜90 g / l添加到焦磷酸盐溶液中,形成电解质组合物,并浸入镁合金表面。通过在电解质组合物中施加5〜200mA / cm ^ 2的电流并将pH控制为8.5〜10.5,将铜镀在镁合金上。组成温度为45〜65℃。氟和碱金属的化合物是氟化锂,氟化钠或氟化钾。

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