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Semiconductor component with a short end structure, which comprises a subtransistor of the semiconductor component, which has a low temperature dependence and method for the manufacture of such a semiconductor device
Semiconductor component with a short end structure, which comprises a subtransistor of the semiconductor component, which has a low temperature dependence and method for the manufacture of such a semiconductor device
The present invention relates to a semiconductor component, the a semiconductor body (1) of a doped semiconductor material having a first zone (5, 8) of a first conductivity type and a to the first zone (5, 8) adjoining second zone (60, 70) of a complementary second conductivity type to the first conductivity type comprises. The first zone (5, 8) and the second zone (60, 70) are connected to a electrically highly conductive layer (3, 4) being connected between the second zone (60, 70) and the electrically highly conductive layer (3, 4), a more than the adjoining regions of the second zone (60, 70) doped connection region (69, 79) of the second conductivity type is arranged, which the second zone (60, 70) and the electrically highly conductive layer (3, 4) electrically connects. In the case in which the first conductivity type of the type "n", there is the connection zone acceptors (68) with an energy level to which, at a temperature of the semiconductor body (1) of 300 k 100 mev to 500 mev by means of the valence band (91) of the semiconductor body (1) is. If the first conductivity type of the type "p" is, the connection zone donors (78) with an energy level (eD) which at a temperature of the semiconductor body (1) of 300 k 100 mev to 500 mev below the conduction band (92) of the semiconductor body (1) is.
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机译:技术领域本发明涉及一种半导体部件,该掺杂半导体材料的半导体本体(1)具有第一导电类型的第一区域(5、8)和与第二区域(5)相邻的第一区域(5,8)。与第一导电类型互补的第二导电类型包括(图60、70)。第一区(5、8)和第二区(60、70)连接到高导电层(3、4),该高导电层连接在第二区(60、70)和高导电层(3,如图4)所示,布置第二导电类型的第二区域(60、70)的掺杂区域之外的第二掺杂区域(69、79),该第二区域(60、70)和高导电层( 3,4)电连接。在类型为“ n”的第一导电类型的情况下,存在具有在半导体本体(1)的温度下为300k 100mev至500mev的能级的连接区受体(68)。借助于半导体本体(1)的价带(91)。如果类型“ p”的第一导电类型为,则在半导体本体(1)的温度为300 k 100的能级(e D Sub>)的连接区施主(78)在半导体主体(1)的导带(92)以下是500mev。
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