首页> 外国专利> Production of a refrigeration module comprises locally depositing by physical vapor deposition a layer on the surfaces of cooling ribs, applying a solder to the solder side of a cooling tube and further processing

Production of a refrigeration module comprises locally depositing by physical vapor deposition a layer on the surfaces of cooling ribs, applying a solder to the solder side of a cooling tube and further processing

机译:制冷模块的生产包括通过物理气相沉积在冷却肋的表面上局部沉积一层,将焊料施加到冷却管的焊料侧并进行进一步处理

摘要

Production of a refrigeration module comprises locally depositing by physical vapor deposition a layer on the surfaces of cooling ribs, applying a solder to the solder side of a cooling tube and heating the solder to the melting point and soldering the cooling ribs to the cooling tube at the site of the coating.
机译:制冷模块的生产包括通过物理气相沉积在冷却肋的表面上局部沉积层,将焊料施加到冷却管的焊料侧,将焊料加热到熔点并将冷却肋焊接到冷却管。涂层的位置。

著录项

  • 公开/公告号DE102008022138A1

    专利类型

  • 公开/公告日2009-11-05

    原文格式PDF

  • 申请/专利权人 ASIA VITAL COMPONENTS CO. LTD.;

    申请/专利号DE20081022138

  • 发明设计人 FENG HUAN XIAO;

    申请日2008-04-29

  • 分类号B23K1/00;B23K1/20;B23P15/26;F28F21/08;

  • 国家 DE

  • 入库时间 2022-08-21 19:09:09

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