首页>
外国专利>
Electronic printed circuit board using sub-filling materials and manufacturing processes for such a printed circuit board
Electronic printed circuit board using sub-filling materials and manufacturing processes for such a printed circuit board
展开▼
机译:使用子填充材料的电子印刷电路板及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
Aboard 1 according to the present invention includes a board main body 3; electronic parts 5 electrically connected to and mounted on the board main body 3; and an under-fill material 19 with which a part between the board main body 3 and a surface of the electronic parts 5 electrically connected to the board main body is filled. A hole 21 passing through a layer 19a of the under-fill material that flows outside from a connecting area of the electronic parts 5 and the board main body 3 is provided for electrically connecting other parts to the board main body.
展开▼