Printed circuit board for electronic module, has relief delimiting zone-to-be-protected from zone-to-be-varnished, where relief creates obstacle to flow of protective varnish from zone-to-be-varnished to zone-to-be-protected

摘要

The board (8) has a zone-to-be-protected (6) and a zone-to-be-varnished (5) that is covered with a protective varnish (16). A separation relief (7) is provided between the zones, where the relief is made of a metallic strip (3) covered by an over thickness of a soldering metal (4). The relief delimits the zone (6) from the zone (5), where the relief creates an obstacle to a flow of protective varnish from the zone (5) to the zone (6). The relief is made of two dedicated parallel metallic strips (3') respectively covered with the over thickness of the soldering metal. An independent claim is also included for a method for obtaining a printed circuit board.