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Printed circuit board, printed circuit board relief patterned metal plates, and method of manufacturing a printed wiring board

机译:印刷电路板,印刷电路板浮雕图案金属板以及印刷电路板的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board which has high smoothness and connection reliability, and to provide a manufacturing method thereof.;SOLUTION: This manufacturing method comprises a step for applying half- etching to a masked metal plate 11, a step for forming paste bumps 12 on an inner layer wiring relief pattern 11B of a wiring member 11D overlapping a prepreg 13 on the paste bumps 12, a step for pressing the prepreg 13 to penetrate it into the paste bumps 12, a step for arranging another wiring member 21 in an opposed position to the wiring member 11D and pressing them to electrically connect wiring members 11D, 21 each other, a step for forming Au bumps on the outer surface of the obtained raw material for the printed circuit board, a step for molding the periphery with a resin and polishing the molded material, and a step for forming a plated layer thereon and selectively etching the plated layer to form a surface wiring pattern.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种具有高平滑度和连接可靠性的印刷电路板,并提供其制造方法。解决方案:该制造方法包括以下步骤:对掩模的金属板11进行半蚀刻。用于在与凸块12上的预浸料13重叠的布线构件11D的内层布线浮雕图案11B上形成凸块12,挤压预浸料13使其渗透到凸块12中的步骤,布置另一布线的步骤部件21处于与布线部件11D相对的位置并按压它们以使布线部件11D,21彼此电连接,该步骤是在所获得的印刷电路板用原材料的外表面上形成金凸块的步骤,以及模制步骤。用树脂在外围进行抛光并模压成型的材料,以及在其上形成镀层并选择性蚀刻该镀层以形成表面布线图案的步骤。版权所有:(C)2003,JPO

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