WET PLATING METHOD AND WET PLATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a wet plating method which can surely control a concentration of a plating accelerator with a relatively easy means and plate the material uniformly, and to provide a wet plating apparatus.;SOLUTION: This wet plating method includes: measuring AC impedances by using respective plating solutions having different concentrations of the plating accelerator; preparing a characteristic figure (a Bode diagram) showing a relation between a phase difference and a frequency, for each concentration of the plating accelerator; determining a frequency region in which the phase difference shows large dependency on the concentration of the plating accelerator, from the characteristic figure of the relation between the phase difference and the frequency; selecting a specific frequency from the frequency region, and also determining a relationship between the concentration of the plating accelerator and the phase difference at the specific frequency beforehand; determining the phase difference by measuring an AC impedance of the plating solution to be used, at the specific frequency; and controlling the replenishing quantity of the plating accelerator so that the phase difference can be kept within a phase difference tolerance.;COPYRIGHT: (C)2011,JPO&INPIT