ELECTRONIC APPARATUS AND CONNECTION FAILURE DETECTING METHOD OF ELECTRONIC COMPONENT USING ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To detect breakage in a junction which joins a circuit board to an electronic component with sufficient accuracy in advance.;SOLUTION: An electronic apparatus includes: a chip component 11 which includes external electrodes; a first solder joint 16-1 for chip which is formed on a first and a second electrode pads 15-1 and 15-2 and is joined to one external electrode 13; a second solder joint 16-2 for chip which is formed on a third electrode pad 15-3 and is joined to the other external electrode 13; and a resistance measuring circuit 18 which is formed on a circuit board 14 and measures a resistance between the first and the second electrode pads 15-1 and 15-2. The first electrode pad 15-1 is formed so that the breakage life of the first solder joint 16-1 for chip determined by the area of the first electrode pad 15-1 become shorter than the breakage life of a solder joint for a semiconductor package which mounts the semiconductor package on the circuit board 14 in the proximity of the chip component 11.;COPYRIGHT: (C)2010,JPO&INPIT