WIRING BOARD REPAIR EQUIPMENT AND WIRING BOARD REPAIR METHOD

摘要

PROBLEM TO BE SOLVED: To make the equipment compact while maintaining high processing accuracy.;SOLUTION: The wiring board repair equipment 20 can destroy a short circuit portion SH appropriately with comparatively compact configuration similarly to a case where a general picosecond laser or femtosecond laser is used, by supplying a pulsating laser drive signal SD from the laser control section 2 of a compact short pulse light source device 1 to a semiconductor laser 3, outputting unique peak light LEP from the semiconductor laser 3 and irradiating the short circuit portion SH formed on the wiring material 100W of the wiring board 100 with the unique peak light LEP while condensing.;COPYRIGHT: (C)2010,JPO&INPIT