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FILM FORMATION METHOD OF FINE WIRE AND FILM FORMING APPARATUS OF FINE WIRE USING THE SAME

机译:细线的成膜方法和使用相同的细线的成膜装置

摘要

PROBLEM TO BE SOLVED: To provide a film formation method of a fine wire of which the wire diameter is 6.5-200 μm and to provide a film forming apparatus using the same.;SOLUTION: The method includes steps of determining the applied portion of the surroundings of the fine wire material and the application speed and applying the coating material by the application means. The film is formed at the surroundings of the fine wire by bringing the application part of the application means into contact with one circumferential end side of the fine wire and transferring the same in the longitudinal direction, and further bringing the application part of the application means into contact with the other circumferential end side of the fine wire and transferring the same in the longitudinal direction.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种线径为6.5-200μm的细线的成膜方法,并提供一种使用该方法的成膜装置。解决方案:该方法包括确定施加部位的步骤。细金属丝材料的周围环境和涂覆速度,以及通过涂覆装置涂覆涂层材料。通过使涂敷装置的涂敷部分与细线的一个圆周端侧接触并在纵向上转移该膜,从而在细线的周围形成膜,并进一步使涂敷装置的涂敷部分成膜。与细线的另一圆周端侧接触并在纵向方向上转移。版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010167389A

    专利类型

  • 公开/公告日2010-08-05

    原文格式PDF

  • 申请/专利权人 UNIV OF MIYAZAKI;

    申请/专利号JP20090014310

  • 发明设计人 KUNITAKE TAKAHITO;KAWANAMI HIROSHI;

    申请日2009-01-26

  • 分类号B05D7/20;B05C1/02;

  • 国家 JP

  • 入库时间 2022-08-21 19:03:57

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