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LAMINATE TYPE CHIP CAPACITOR, LAMINATE TYPE CHIP CAPACITOR ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

机译:叠片式芯片电容器,叠片式电容器组件及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a laminate type chip capacitor having such a new structure that a user directly adjusts the characteristics of equivalent series resistance (ESR) required by use conditions thereof, a laminate type chip capacitor assembly, and a method of manufacturing the same.;SOLUTION: The laminate type capacitor includes: a capacitor body formed by allowing a plurality of dielectric layers to be laminated; a plurality of first and second internal electrodes which are alternately disposed so that the internal electrodes of different polarities face each other via the dielectric layers in the capacitor body; and m (m≥3) pieces of first and second external electrodes each of which is formed in the same number on both sides opposite to each other out of surfaces of the capacitor body.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种叠层型片状电容器,该叠层型片状电容器组件及其制造方法提供了一种新的结构,使得用户可以根据使用条件直接调节其等效串联电阻(ESR)的特性。解决方案:层叠型电容器包括:通过允许多个电介质层被层叠而形成的电容器主体;多个第一和第二内部电极交替布置,使得极性不同的内部电极隔着电容器主体中的介电层彼此面对。电容器主体表面的彼此相对的两侧以相同的数目形成有m(m≥ 3)个第一和第二外部电极。版权所有:(C)2010,JPO&INPIT

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