When it deals with the semiconductor chips

摘要

PROBLEM TO BE SOLVED: To enhance the strength of a semiconductor solid piece subjected to dicing by machining.;SOLUTION: With regarad to a group of semiconductor solid pieces 90 on a protection sheet 89 divided along dicing lines 17, damage areas h1 and h2 are removed by etching from surfaces 90a and 90b subjected to machining including the side faces subjected to dicing.;COPYRIGHT: (C)2007,JPO&INPIT