PROBLEM TO BE SOLVED: To provide a polishing pad with which variation of processing speed becomes smaller than permitted variation ratio if rotation speed of the polishing pad is set within a range of 25-150 rpm which is the normally used rotation speed, to provide an electrolytic compound polishing device, and to provide an electrolytic compound polishing method.;SOLUTION: The polishing pad 101 has a through-hole to be installed on the opposite electrode of the electrolytic compound polishing device used for electrolytic compound polishing of a metal film on the substrate surface, and is characterized in that a hole diameter D of the through-hole 101a is within a range of 0.1-5 mm, a thickness h is within a range of 0.5-5 mm, and square of the hole diameter/thickness (D2/h) is within a range of 0.002-50 mm.;COPYRIGHT: (C)2010,JPO&INPIT
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机译：要解决的问题：提供一种抛光垫，如果将抛光垫的旋转速度设置在通常使用的旋转速度25-150 rpm的范围内，其加工速度的变化将变得小于允许的变化率。解决方案：抛光垫101具有通孔，该通孔安装在用于对金属膜上的金属膜进行电解复合抛光的电解复合抛光装置的相对电极上。其特征在于，通孔101a的孔径D在0.1-5mm的范围内，厚度h在0.5-5mm的范围内，并且孔径/厚度的平方（ D 2 / h）在0.002-50 mm范围内;版权：（C）2010，JPO＆INPIT
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