首页> 外国专利> HORIZONTAL LIGHT EMITTING TYPE SUBSTRATE FOR LOADING LED, LED-LOADED HORIZONTAL LIGHT EMITTING TYPE SUBSTRATE, HORIZONTAL LIGHT EMITTING TYPE MODULE, HORIZONTAL LIGHT RECEIVING TYPE SUBSTRATE FOR LOADING LIGHT RECEIVING ELEMENT, HORIZONTAL LIGHT RECEIVING TYPE SUBSTRATE WITH LOADED LIGHT RECEIVING ELEMENT, HORIZONTAL LIGHT RECEIVING TYPE MODULE AND HORIZONTAL MODULE

HORIZONTAL LIGHT EMITTING TYPE SUBSTRATE FOR LOADING LED, LED-LOADED HORIZONTAL LIGHT EMITTING TYPE SUBSTRATE, HORIZONTAL LIGHT EMITTING TYPE MODULE, HORIZONTAL LIGHT RECEIVING TYPE SUBSTRATE FOR LOADING LIGHT RECEIVING ELEMENT, HORIZONTAL LIGHT RECEIVING TYPE SUBSTRATE WITH LOADED LIGHT RECEIVING ELEMENT, HORIZONTAL LIGHT RECEIVING TYPE MODULE AND HORIZONTAL MODULE

机译:用于装载LED的水平发光型基质,用于LED装载的水平发光型基质,水平发光型组件,用于接收光的水平光接收型基质,用于接收的元件的水平型,水平的光接收型基质模块和水平模块

摘要

PROBLEM TO BE SOLVED: To provide a horizontal light emitting type substrate for loading an LED which demonstrates high thermal resistance even if it is formed using a resinous insulating material, etc.;SOLUTION: A substrate 3 is the one which emits light in a direction Y1 when the LED 50 is mounted in a storage part 30 opened in the direction Y1, and provided with: a metal bottom radiation layer 32; a lower step part constitution layer 33 laminated on the bottom radiation layer 32; a wiring layer 34 for LED having a land part laminated on the lower step part constitution layer 33; a middle step part constitution layer 35 laminated by exposing the land part of the wiring layer 34 for LED in the storage part 30; an upper step part constitution layer 36 laminated on the middle step part constitution layer 35; and a metal upper radiation layer 37 laminated on the upper step part constitution layer 36, wherein an end surface 331 is inclined to spread upward and an end surface 361 is inclined to spread downward, respectively, and their surfaces have light reflection layers 39. A substrate 2 is provided with the substrate 3 and the LED 50, and a module is provided with the substrate 2 and a mother board.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种用于装载LED的水平发光型基板,该基板即使使用树脂绝缘材料等形成也具有高的热阻;解决方案:基板3是沿方向发光的基板。当将LED 50安装在沿Y1方向敞开的存储部30中时,Y1具有:金属底部辐射层32;以及在Y50处的Y1。层叠在底部辐射层32上的下部台阶构成层33。在下台阶部构成层33上层叠有焊盘部的LED用配线层34。通过将LED用配线层34的接地部分暴露在存储部分30中而层压的中间台阶部分构成层35;层叠在中间台阶部构成层35上的上部台阶部构成层36。层叠在上台阶部构成层36上的金属上散热层37,其端面331向上方倾斜,端面361向下方倾斜,且其表面具有光反射层39。基板2设置有基板3和LED 50,并且模块设置有基板2和母板。;版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2009295948A

    专利类型

  • 公开/公告日2009-12-17

    原文格式PDF

  • 申请/专利权人 TRION:KK;

    申请/专利号JP20080179608

  • 发明设计人 KENDO NOBUO;UEDA YOSHIO;

    申请日2008-07-09

  • 分类号H01L33;H01L31/02;

  • 国家 JP

  • 入库时间 2022-08-21 19:01:54

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