PATTERN VERIFICATION METHOD, PATTERN DETERMINATION METHOD, METHOD OF DETERMINING MANUFACTURING CONDITION, PATTERN VERIFICATION PROGRAM, AND PROGRAM FOR VERIFYING MANUFACTURING CONDITION

摘要

PROBLEM TO BE SOLVED: To provide a pattern verification method, a pattern determination method, a method of determining manufacturing conditions, a pattern verification program and a program for verifying manufacturing conditions, for forming a pattern of a desired shape even when a manufacturing apparatus for a semiconductor device is added or manufacturing conditions are changed.;SOLUTION: The pattern verification method creates a new pattern evaluation criterion by setting a dimensional tolerance of a pattern to be formed on a wafer by using at least one of the following steps, so that a pattern in a desired shape can be formed even when a new manufacturing apparatus is added or other events which may occur later. The steps includes : a step of comparing dimensional differences between patterns formed on mask substrates or wafers by using a plurality of semiconductor manufacturing apparatuses of the same kind, and acquiring the difference as an error between apparatuses; and a step of acquiring a systematic error as a manufacturing system error between a target pattern to be formed in a manufacturing step using at least one apparatus in the plurality of semiconductor manufacturing apparatuses of the same kind, and a pattern actually formed.;COPYRIGHT: (C)2010,JPO&INPIT