PROBLEM TO BE SOLVED: To provide an infrared reflow temperature controller which has simpler structure and enables a circuit board to be uniformly heated and enables reliability of an electronic component after mounted (after subjected to solder processing) to be improved.;SOLUTION: The infrared reflow temperature controller 30 is constituted of: an infrared transmission member 24 which uses as a base a workpiece 10 having a circuit board 12 on which the electronic components 14-20 are mounted, and which can transmit infrared light 34; and coloring parts 26, 28 which are formed in the infrared transmission member 24 in order to adjust heating amounts of the electronic components 14-20 when the circuit board 12 is irradiated with the infrared light 34 from an infrared reflow device 32 via the infrared transmission member 24 while the infrared transmission member 24 is put on the circuit board 12.;COPYRIGHT: (C)2010,JPO&INPIT
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