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Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan

机译:循环风机红外加热回流炉3D气流温度场的实验与数值研究

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摘要

This study presents the experimental and numerical analysis of the thermal process for laboratory scale desktop lead-free reflow oven and discusses a 3D CFD model of radiation heating with forced-air convection from circulating stainless steel fan. The experiments were carried out to determine the temperature boundary condition of infrared heating element. In addition, the RPM of the rotating fan was measured using HT50 tachometers. To validate the spatial temperature of the oven, a set of industrial standard thermocouples was employed in various positions. The device was accessed throughout all stages of temperature reflow profile. The profile setting of the oven is in accordance to standard JSTD-020D. The desktop reflow oven was then numerically simulated using the computational model and the advanced user-defined functions (UDFs) were developed to model the thermal profile. The study reveals the temperature distribution of the desktop reflow oven is dependent on the air circulation in the oven at various positions. The temperature contour and air circulation in the oven chamber were demonstrated in the numerical simulation. The experimental and simulation results are useful for further improvement of temperature uniformity within the oven chamber for a convective IR heating reflow oven. The temperature results show a satisfactory agreement with both experiment and simulation.
机译:这项研究提供了实验室规模的台式无铅回流焊炉热过程的实验和数值分析,并讨论了循环不锈钢风扇强制强制对流辐射加热的3D CFD模型。通过实验确定红外加热元件的温度边界条件。此外,使用HT50转速表测量了旋转风扇的RPM。为了验证烤箱的空间温度,在不同位置使用了一组工业标准热电偶。在温度回流曲线的所有阶段都访问了该设备。烤箱的配置文件设置符合标准JSTD-020D。然后,使用计算模型对台式回流炉进行数值模拟,并开发了高级用户定义函数(UDF)以对热曲线进行建模。研究表明,台式回流炉的温度分布取决于炉内各个位置的空气循环。数值模拟显示了烤箱室内的温度轮廓和空气循环。实验和模拟结果对于进一步改善对流红外加热回流焊炉的炉室内温度均匀性很有用。温度结果与实验和仿真结果均显示令人满意的一致性。

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  • 来源
  • 作者单位

    Advance Packaging and SMT Unit, School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia,Advance Mechatronic Laboratory, Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia;

    Advance Packaging and SMT Unit, School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia;

    Advance Packaging and SMT Unit, School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia;

    Advance Packaging and SMT Unit, School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Desktop lead-free reflow oven; CFD; Forced-air convection; IR heating;

    机译:台式无铅回流焊炉;差价合约强制空气对流;红外加热;

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