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METHOD FOR MANUFACTURING OPTICAL INTERFACE MODULE AND OPTICAL INTERFACE MODULE

机译:光学界面模块的制造方法及光学界面模块

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical interface module, which uses a method of easily and reliably connecting a light-emitting element and a light-receiving element to an optical waveguide.;SOLUTION: The method of manufacturing an optical interface module includes: forming a lower clad layer on a first surface of a substrate having a first and a second surface; forming a core layer on the lower clad layer and forming two grooves in part of the core layer to form a first core part between the two grooves having one end and another end; forming an upper clad layer on the core layer and in the grooves; mounting a light-emitting element on the first surface of the substrate; mounting a light-receiving element on the first surface of the substrate; forming a second core part optically coupled to the light-emitting element and one end of the first core part, by installing two grooves by laser machining in the upper clad layer and the core layer between the light-emitting element and one end of the first core part; and forming a third core part optically coupled to the light-receiving element and the other end of the first core part, by installing two grooves by laser machining in the upper clad layer and the core layer between the light-receiving element and the other end of the first core part.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种制造光接口模块的方法,该方法使用一种容易且可靠地将发光元件和光接收元件连接至光波导的方法。接口模块包括:在具有第一表面和第二表面的衬底的第一表面上形成下部覆盖层;在下覆层上形成芯层,并在芯层的一部分上形成两个凹槽,以在两个凹槽之间形成具有一端和另一端的第一芯部;在芯层上和凹槽中形成上覆层;在基板的第一表面上安装发光元件。在基板的第一表面上安装光接收元件。通过在上覆层和芯层中通过激光加工安装两个凹槽,在发光元件和第一芯的一端之间形成两个光学耦合到发光元件和第一芯部分的一端的第二芯部分。核心部分通过在上覆层和芯层之间在受光元件和另一端之间的上覆层和芯层中安装两个凹槽,从而形成与光接收元件和第一芯部分的另一端光学耦合的第三芯部分。第一核心部分的内容;版权:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010026508A

    专利类型

  • 公开/公告日2010-02-04

    原文格式PDF

  • 申请/专利权人 IBIDEN CO LTD;

    申请/专利号JP20090147899

  • 发明设计人 KODAMA HIROAKI;NAKAJIMA KENSAKU;

    申请日2009-06-22

  • 分类号G02B6/13;H01S5/022;G02B6/122;

  • 国家 JP

  • 入库时间 2022-08-21 19:01:23

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