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DESIGN METHOD OF THREE-DIMENSIONAL INTEGRATED CIRCUIT, AND DESIGN PROGRAM OF THREE-DIMENSIONAL INTEGRATED CIRCUIT

机译:三维集成电路的设计方法及三维集成电路的设计程序

摘要

PPROBLEM TO BE SOLVED: To reduce the number of wires exceeding 100 m in a wire length without much increasing the number of laminated layers, and to improve circuit performance. PSOLUTION: In a design method of a three-dimensional integrated circuit, an integrated circuit is disposed in a temporary layout region on an XP plane short in an X direction and long in a Y direction (S1), and then, the temporary layout region is divided into 2N or more small regions in the Y direction and one block is constructed for every N small areas (S2), and respective blocks are folded in the Y direction per small region to laminate N layers of integrated circuits so that the kN-th and kn+1th small regions are in a top layer or a bottom layer. PCOPYRIGHT: (C)2010,JPO&INPIT
机译:

要解决的问题:在不大大增加叠层数的情况下,减少线长超过100 m的线数,并改善电路性能。

解决方案:在三维集成电路的设计方法中,将集成电路布置在XP平面上的临时布局区域中,该XP平面上的X方向短,Y方向长(S1),然后,在Y方向上将临时布局区域划分为2N或更多个小区域,并且每N个小区域构造一个块(S2),并且每个小区域在Y方向上折叠各个块以层叠N层集成电路,从而第kN个和第kn + 1个小区域位于顶层或底层。

版权:(C)2010,日本特许厅&INPIT

著录项

  • 公开/公告号JP2010080610A

    专利类型

  • 公开/公告日2010-04-08

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP20080245972

  • 发明设计人 FUJITA SHINOBU;

    申请日2008-09-25

  • 分类号H01L21/82;H01L21/822;H01L27/04;G06F17/50;

  • 国家 JP

  • 入库时间 2022-08-21 19:01:10

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