METHOD FOR SOLDERING MOUNTING COMPONENT TO BE INSERTED, STRUCTURE FOR SOLDERING MOUNTING COMPONENT TO BE INSERTED, AND ELECTRONIC CIRCUIT SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide: a method for soldering a mounting component to be inserted which suitably forms a fillet on a side of components of a printed wiring board; a soldering structure in which soldering is performed by the method; and an electronic circuit substrate.;SOLUTION: The soldering method is to mount a mounting component to be inserted on the printed wiring board on which through-hole lands 21U, 21d are formed on each of component surfaces of surface/back and soldering surface. Creamy solder is applied on the through-hole land 21U of the component surface. The creamy solder is heated by reflow, the creamy solder is wetly spread on the through-hole land 21U, is hardened, and comes to reserve solder. The lead of the mounting component 30 is inserted from the component surface side of the printed wiring board passing through the reflow process into the through-hole. The solder is supplied from the solder surface side of the printed wiring board to the through-hole, then to unite the supplied solder and reserve solder allows the lead 30 to be soldered to the through-hole.;COPYRIGHT: (C)2010,JPO&INPIT