Adhesive layer forming liquid between copper and resin for wiring board and method for producing adhesive layer between copper and resin for wiring board using the liquid

摘要

PPROBLEM TO BE SOLVED: To provide a bonded layer of copper with a resin-forming liquid capable of improving the bonding force of the copper with the resin, a method for producing the bonded layer of the copper with the resin by using the liquid and a laminated material of them . PSOLUTION: This resin bonded layer-forming liquid contains an aqueous solution containing (a) at least 1 kind selected from an inorganic acid and organic acid, (b) a tin salt or tin oxide, (c) at least 1 kind of oxide of a metal selected from silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold and platinum, (d) a reaction accelerator and (e) a dispersed system-holding solvent, and a method for forming the bonded layer is provided by bringing the bonded layer-forming liquid in contact with the surface of the copper (1) to form an alloy layer of tin and the metal of the oxide (c), then removing the alloy layer of tin and the metal of the oxide (c) by leaving behind the copper and a layer where the tin and the metal of the oxide (c) diffuse, for forming the bonded layer (2) of the resin containing copper, the alloy of tin and the metal of the oxide (c) on the copper. PCOPYRIGHT: (C)2005,JPO&NCIPI