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The technology which agrees efficiency between the ion implantation device making use of in situ mask

机译:利用原位掩模的离子注入装置之间的效率达成一致的技术

摘要

A technique for matching performance of ion implantation devices using an in-situ mask. In one particular exemplary embodiment, ion implantation is performed on a portion of a substrate while the remainder is masked off. The substrate is then moved to a second implanter tool. Implantation is then performed on another portion of the same substrate using the second tool while a mask covers the remainder of the substrate, including the first portion. After the second implantation process, parametric testing may be performed on semiconductor devices manufactured on the first and second portions to determine if there is variation in one or more performance characteristics of these semiconductor devices. If variations are found, changes may be suggested to one or more operating parameters of one of the implantation tools to reduce performance variation of implanters within the fabrication facility.
机译:一种使用原位掩模匹配离子注入设备性能的技术。在一个特定的示例性实施例中,在掩膜其余部分的同时,在衬底的一部分上执行离子注入。然后将衬底移动到第二注入机。然后使用第二工具在同一衬底的另一部分上进行注入,同时掩模覆盖衬底的其余部分,包括第一部分。在第二注入工艺之后,可以对在第一部分和第二部分上制造的半导体器件执行参数测试,以确定这些半导体器件的一个或多个性能特征是否存在变化。如果发现变化,则可以建议对一种植入工具的一个或多个操作参数进行更改,以减少制造设施中植入机的性能变化。

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