In regard to chemical machine grinding process and

摘要

PROBLEM TO BE SOLVED: To prevent the part of a filler layer between the protruded sections of a patternized stop layer from being excessively polished by partially exposing at least a stop layer, and next sufficiently exposing the stop layer by the use of slurry having low selectivity. ;SOLUTION: A substrata 10 is polished at first on polishing stations 25a, 25b by the use of 'high selectivity' slurry and a hard polishing pad 110, or both a laminated polishing pad 100 and a hard polishing pad 110. After judging by a terminal point detector that at least partially a stop layer is exposed, the substrate 10 is put to 'a repolishing stage' so that substantially all the upper face of the stop layer is actually and surely exposed. When the substrate 10 is put to the repolishing stage, about half of the stop layer is exposed. For the repolishing stage, the substrate 10 is polished on the polishing pad by the use of non-selectivity or 'low selectivity' polishing slurry in a final polishing station 25c.;COPYRIGHT: (C)2000,JPO