Being the abrasive cloth which is used in order to grind the process manner of the abrasive cloth and the abrasive cloth

摘要

Mean value of sum total of the groove cubic measure where as for this invention, being the abrasive cloth in order to grind the semiconductor baseplate, the groove where at least it possesses radial pattern on the said cloth surface is formed, as for the said groove, (in the baseplate falling perpendicularly section/the area of the baseplate) of 0.06 or more and to be things such as of 0.23 or less, in addition, the said groove to be something which than groove depth of the groove part where groove depth of the groove part which is located on central side than the aforementioned baseplate is directly under the aforementioned baseplate was shallower formed, the intersection to be piled up with the groove and the groove in the central part of radial pattern of the aforementioned grooveIt is the abrasive cloth and its process method and the production method of the baseplate which uses this of featuring that it is something which does not exist directly under the aforementioned baseplate. Because of this, at the time of semiconductor baseplate grinding it is possible to grind with high degree of evenness the abrasives the necessary quantity by being supplied to the baseplate center, furthermore peeling and twists, Bali not to occur, the abrasive cloth and its process method and the production method of the baseplate of not attaching the scratch to the semiconductor baseplate surface are offered.