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Being the substrate marginal central processing unit which choice administers

机译:作为选择管理的基材边缘中央处理单元

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and method for processing a substrate periphery capable of obtaining a desired etching width easily.;SOLUTION: A screening plate 19 is fixed to the lower end of a rotated shaft 20 arranged coaxially with a rotated shaft 13 of a spin base 12. The rotated shaft 20 is connected to a screening plate traverse drive mechanism 21 for moving the screening plate 19 in the plane direction of a substrate W. In the screening plate traverse drive mechanism 21, the rotated shaft 20 for rotating the screening plate 19 is connected to an arm. The arm is connected to one support member. In the support member, a nut section, where a screw shaft is screwed, is provided. The screw shaft is connected to the rotated shaft of a motor via other support members. The arm is moved in the plane direction on the substrate W by rotating the motor forward and backward.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种能够容易地获得期望的蚀刻宽度的用于处理基板外围的设备和方法;解决方案:筛板19固定到与旋转轴13同轴布置的旋转轴20的下端。旋转轴20连接到用于在基板W的平面方向上移动筛板19的筛板横移驱动机构21。在筛板横移驱动机构21中,用于旋转的旋转轴20筛板19连接到臂。所述臂连接到一个支撑构件。在支撑构件中,设置有螺母部,在该螺母部上拧入了螺钉轴。丝杠轴经由其他支撑构件连接至电动机的旋转轴。通过向前和向后旋转电机,使臂在基板W上沿平面方向移动。版权所有:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP4368288B2

    专利类型

  • 公开/公告日2009-11-18

    原文格式PDF

  • 申请/专利权人 大日本スクリーン製造株式会社;

    申请/专利号JP20040318232

  • 发明设计人 横内 健一;

    申请日2004-11-01

  • 分类号H01L21/306;H01L21/304;

  • 国家 JP

  • 入库时间 2022-08-21 18:58:08

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