Production mannered null base course conductor layer of joint material and the production manner

摘要

PROBLEM TO BE SOLVED: To provide a connected material realizing interlayer connection with high integration density and productivity and extremely low connection resistance, its connection structure and its producing method.;SOLUTION: A nickel plating 3 is applied entirely to one side of a copper foil 1 (main conductor layer), nickel patterned plating 2 is applied to the opposite side and a copper plating 5 (basic layer conductor layer) is formed on the surface of the nickel plating 3. Using the nickel plating 2 as a mask, the copper foil 1 is etched to obtain discrete protrusions 10 which are then used as a mask for etching the nickel plating 3. Subsequently, the nickel plating 2 is heated and bent to project upward thus obtaining a connecting material where the conductive path is substantially composed of a solid metal (e.g. the copper foil 1) at the connecting part. Furthermore, a connection structure is obtained by pressing a matter being connected against the connecting material.;COPYRIGHT: (C)2002,JPO