Soldered device, production manner of soldered manner and soldered item

摘要

Topic While heating the junction part of the electronic parts and the substrate preliminary, more satisfactory soldered Characteristic by injecting the melting solder to the direct junction part the solder without heating above the temperature which is necessary for dissolution, guaranteeing, the soldered device whose it is possible soldered, it is soldered manner and to offer the production manner of the soldered item. Solutions The soldered device, has with the solder injection means which inject the solder in the line melting in the junction part of the suffering soldered part and aforementioned the electrification means which heat the solder in the line which was injected with electrification. Choice figure Drawing 1