IC Package Method Capable of Decreasing IR Drop and Associated IC Apparatus

摘要

An IC package method capable of decreasing IR drop of a chip and associated IC apparatus is provided. The IC package method comprises forming a lead frame including a die paddle and a plurality of fingers; installing a die on the die paddle, and coupling a plurality of signal terminals of the die to the fingers; forming a power transferring unit coupled to a power supply; coupling power reception terminals of a plurality of logic units in the die to the power transferring unit; and forming a housing for encapsulating the die, the lead frame and the power transferring unit.