Bonded Microfluidic System Comprising Thermal Bend Actuated Valve

摘要

A microfluidic system comprising a MEMS integrated circuit bonded to a microfluidics platform. The microfluidics platform comprises a polymeric body having at least one microfluidic channel defined therein. The MEMS integrated circuit comprises at least one thermal bend actuator. The microfluidic system is configured such that movement of the actuator causes closure of the channel.