首页>
外国专利>
INVERTER POWER MODULE FOR WITH DISTRIBUTED SUPPORT FOR DIRECT SUBSTRATE COOLING
INVERTER POWER MODULE FOR WITH DISTRIBUTED SUPPORT FOR DIRECT SUBSTRATE COOLING
展开▼
机译:具有分布式支持的直接功率模块,用于直接基板冷却
展开▼
页面导航
摘要
著录项
相似文献
摘要
Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.
展开▼