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Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions

机译:具有由退火的氧离子注入区形成的隔离区的半导体器件的制造方法

摘要

Methods of fabricating a semiconductor device include forming a mask pattern on a semiconductor substrate and which exposes defined regions of the semiconductor substrate. Oxygen ions are implanted into the defined regions of the semiconductor substrate using the mask pattern as an ion implantation mask. The oxygen ion implanted regions of the semiconductor substrate are annealed at one or more temperatures in a range that is sufficiently high to form silicon oxide substantially throughout the oxygen ion implanted regions by reacting the implanted oxygen ions with silicon in the oxygen ion implanted regions, and that is sufficiently low to substantially prevent oxidation of the semiconductor substrate adjacent to the oxygen ion implanted regions.
机译:制造半导体器件的方法包括在半导体衬底上形成掩模图案,该掩模图案暴露出半导体衬底的限定区域。使用掩模图案作为离子注入掩模,将氧离子注入到半导体衬底的限定区域中。通过使注入的氧离子与氧离子注入区中的硅反应,在一个或多个温度下对半导体衬底的氧离子注入区进行退火,该温度足够高以基本上在整个氧离子注入区中形成氧化硅。它足够低以基本上防止与氧离子注入区相邻的半导体衬底的氧化。

著录项

  • 公开/公告号US7781302B2

    专利类型

  • 公开/公告日2010-08-24

    原文格式PDF

  • 申请/专利权人 YONG-WON CHA;DAE-LOK BAE;

    申请/专利号US20070703316

  • 发明设计人 YONG-WON CHA;DAE-LOK BAE;

    申请日2007-02-07

  • 分类号H01L21/76;

  • 国家 US

  • 入库时间 2022-08-21 18:50:32

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