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Phase change memory cell having interface structures with essentially equal thermal impedances and manufacturing methods
Phase change memory cell having interface structures with essentially equal thermal impedances and manufacturing methods
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机译:具有具有基本相等的热阻的界面结构的相变存储单元及其制造方法
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摘要
A memory device as described herein includes a memory member contacting first and second interface structures. The first interface structure electrically and thermally couples the memory member to access circuitry and has a first thermal impedance therebetween. The second interface structure electrically and thermally couples the memory member to a bit line structure and has a second thermal impedance therebetween. The first and second thermal impedances are essentially equal such that applying a reset pulse results in a phase transition of an active region of the memory member spaced away from both the first and second interface structures.
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