首页> 外国专利> Method of fabricating polycrystalline silicon, TFT fabricated using the same, method of fabricating the TFT, and organic light emitting diode display device including the TFT

Method of fabricating polycrystalline silicon, TFT fabricated using the same, method of fabricating the TFT, and organic light emitting diode display device including the TFT

机译:多晶硅的制造方法,使用该多晶硅制造的TFT,该TFT的制造方法以及包括该TFT的有机发光二极管显示装置

摘要

A method of fabricating a polycrystalline silicon (poly-Si) layer includes providing a substrate, forming an amorphous silicon (a-Si) layer on the substrate, forming a thermal oxide layer to a thickness of about 10 to 50 Å on the a-Si layer, forming a metal catalyst layer on the thermal oxide layer, and annealing the substrate to crystallize the a-Si layer into the poly-Si layer using a metal catalyst of the metal catalyst layer. Thus, the a-Si layer can be crystallized into a poly-Si layer by a super grain silicon (SGS) crystallization method. Also, the thermal oxide layer may be formed during the dehydrogenation of the a-Si layer so that an additional process of forming a capping layer required for the SGS crystallization method can be omitted, thereby simplifying the fabrication process.
机译:一种制造多晶硅(poly-Si)层的方法包括:提供衬底;在衬底上形成非晶硅(a-Si)层;在a-上形成厚度为约10至50的热氧化层。 Si层,在热氧化物层上形成金属催化剂层,并使用金属催化剂层的金属催化剂使基板退火以将a-Si层结晶为多晶硅层。因此,可以通过超晶粒硅(SGS)结晶方法将a-Si层结晶为多晶硅层。而且,可以在a-Si层的脱氢期间形成热氧化物层,从而可以省略SGS结晶方法所需的形成覆盖层的附加工艺,从而简化了制造工艺。

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