首页> 外国专利> OXIDE MATERIAL, PATTERNING SUBSTRATE, METHOD OF FORMING A PATTERN, METHOD OF PRODUCING AN IMPRINT TRANSFER MOLD, METHOD OF PRODUCING A RECORDING MEDIUM, IMPRINT TRANSFER MOLD, AND RECORDING MEDIUM

OXIDE MATERIAL, PATTERNING SUBSTRATE, METHOD OF FORMING A PATTERN, METHOD OF PRODUCING AN IMPRINT TRANSFER MOLD, METHOD OF PRODUCING A RECORDING MEDIUM, IMPRINT TRANSFER MOLD, AND RECORDING MEDIUM

机译:氧化物材料,形成基质的材料,形成图案的方法,制造印痕转移模具的方法,制造记录介质,印痕转移模具和记录介质的方法

摘要

An oxide material (102) is used as masking for patterning by etching which is performed with respect to a substrate or a material laminated on the substrate (101). The oxide material is also used in a multi-step etching which is performed by using a resist (103) formed on the oxide material as a mask. The etching rate of the oxide material for a reaction gas containing an inert gas or hydrogen is higher than the etching rate of the resist for the reaction gas containing an inert gas or hydrogen, while the etching rate of the oxide material for a fluorine-containing gas is lower than the etching rate of the material, which is to be patterned by using the oxide material as a mask, for the fluorine-containing gas. In addition, the oxide material is soluble in a weak acid.
机译:氧化物材料( 102 )用作对基板或层压在基板上的材料( 101 )进行蚀刻的图案化掩模。该氧化物材料还用于通过使用形成在氧化物材料上的抗蚀剂( 103 )作为掩模来执行的多步骤蚀刻中。包含惰性气体或氢的反应气体的氧化物材料的蚀刻速率高于包含惰性气体或氢的反应气体的抗蚀剂的蚀刻速率,而包含氟的氧化物材料的蚀刻速率高。气体比含氧气体的蚀刻速率低,该材料的蚀刻速率将通过使用氧化物材料作为掩模来图案化。另外,氧化物材料可溶于弱酸。

著录项

  • 公开/公告号US2010003469A1

    专利类型

  • 公开/公告日2010-01-07

    原文格式PDF

  • 申请/专利权人 MEGUMI FUJIMURA;YASUO HOSODA;

    申请/专利号US20070443039

  • 发明设计人 MEGUMI FUJIMURA;YASUO HOSODA;

    申请日2007-09-28

  • 分类号B32B5;C01G28;C03C15;

  • 国家 US

  • 入库时间 2022-08-21 18:49:22

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