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High resolution patterning of surface energy utilizing high resolution monomolecular resist for fabrication of patterned media masters
High resolution patterning of surface energy utilizing high resolution monomolecular resist for fabrication of patterned media masters
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机译:利用高分辨率单分子抗蚀剂对表面能进行高分辨率构图,以制造构图的介质母版
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摘要
A method for patterning and forming very small structures on a substrate such as a wafer. The process uses a difference in surface energy between a mask and the substrate to selectively deposit a hard mask material such as a metal onto the surface of the substrate. The mask can be formed extremely thin, such as only an atomic mono-layer thick, and can be patterned by ion beam photolithography. The pattern can, therefore, be formed with extremely high resolution. The thin mask layer can be constructed of various materials and can be constructed of perfluoropolyether diacrylate (PDA), which can be dip coated to and exposed to form a desirable positive photoresist mask layer.
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