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Adhesive of a silicon and silica composite for bonding together silicon parts

机译:硅和二氧化硅复合材料的粘合剂,用于将硅部件粘合在一起

摘要

A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 μm and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size may be formed by CVD. Larger particles may be milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.
机译:一种接合两个硅构件的方法,用于该方法的粘合剂以及接合的产品,特别是用于支撑多个硅晶片的硅塔。制备可流动的粘合剂,其包含尺寸小于100μm且优选小于100nm的硅颗粒和二氧化硅桥联剂,例如旋涂玻璃。可以通过CVD形成约20nm尺寸的纳米硅微晶。较大的颗粒可以由原始多晶硅研磨而成。如果需要的话,加入诸如重的,优选为水不溶性的醇之类的延缓剂,例如萜品醇,以使粘合剂在室温下缓慢固化。将混合物施加到连接区域。硅部件在足以连接二氧化硅的温度下组装和退火,对于纳米硅,优选在900℃至1100℃,而对于研磨硅,则更高。

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